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During the soldering process, after the solder paste has been applied to the board, there are two ways to place the SMD. The first way is that you can use a heat gun to blow the tin paste to semi-solidify, then place the electronic components on the surface of the semi-solidified tin, and finally use a heat gun to solidify the tin completely. The second way is to put the electronic components in the tin paste first, and then use a heat gun to solidify the tin paste.Tools used in this video:
1. Hash board chip flux paste: https://www.zeusbtc.com/ASIC-Miner-Repair/Parts-Tools-Details.asp?ID=1765
2. Stainless Steel Tweezers Kit for IC Repair: https://www.zeusbtc.com/ASIC-Miner-Repair/Parts-Tools-Details.asp?ID=1668
3. ANLIXIN-862D desoldering station: https://www.zeusbtc.com/ASIC-Miner-Repair/Parts-Tools-Details.asp?ID=125
4. Circuit board cleaning solution: https://www.zeusbtc.com/ASIC-Miner-Repair/Parts-Tools-Details.asp?ID=1782
5. Tin paste: https://www.zeusbtc.com/ASIC-Miner-Repair/Parts-Tools-Details.asp?ID=1821
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